[PATCH v2 0/3] net/bonding: support device private dump

[Ferruh Yigit]

On 12/15/2022 10:56 AM, lihuisong (C) wrote:

> 
> 在 2022/12/14 17:55, humin (Q) 写道:

>>
>> 在 2022/12/14 14:13, Chengwen Feng 写道:
>>> This patchset adds device private dump for bonding PMD, and use
>>> rte_eth_dev_priv_dump API to implement testpmd show bonding command.
>>>
>>> Chengwen Feng (3):
>>>    net/bonding: support private dump ops
>>>    net/bonding: support dump LACP info
>>>    net/bonding: use dump API to impl show bonding cmd
>>>
>>> ---
>>> v2:
>>> * address Min Hu's comment
>>> * use rte_eth_dev_priv_dump API to implement testpmd show bonding
>>>    command.
>>>
>>>   .../link_bonding_poll_mode_drv_lib.rst        |  13 +-
>>>   drivers/net/bonding/bonding_testpmd.c         | 281 +-----------------
>>>   drivers/net/bonding/rte_eth_bond_pmd.c        | 244 ++++++++++++++-
>>>   3 files changed, 249 insertions(+), 289 deletions(-)
>>>
>> Acked-by：Min Hu (Connor) <humin29 at huawei.com>
>
> Indeed, it is better to move them to bonding PMD. lgtm
> Series-acked-by: Huisong Li <lihuisong at huawei.com>

+1 to move code to bonding PMD & merge LACP info withing show bonding
config command and remove the redundant one from bonding testpmd,

For series,
Acked-by: Ferruh Yigit <ferruh.yigit at amd.com>


Series applied to dpdk-next-net/main, thanks.